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EMI application
Building Your Own EMI Troubleshooting and Pre-Compliance Kit Monday, October 17, 2022
Dylan Stinson, Product Marketing Manager at Tektronix, recently penned an article for the Interference Technology’s 2022 EMC Testing Guide: How to Build Your Own EMI Troubleshooting and Pre-Compliance Kit. We wanted to share some of the key insights here. Failing EMI/EMC compliance testing can certainly ruin a design engineer’s day. The costs and time delays associated with a failed test can add …
Tektronix 5 Series B MSO
Customer-Driven Improvements to the 5 Series MSO Wednesday, January 12, 2022
Customer-Driven Improvements in the New 5 Series B MSO Deliver an Even Better User Experience and More Capabilities  Oscilloscopes are among the most important tools in the electronics industry.  So, it’s not surprising that the choice of a specific oscilloscope by an engineer can be a deeply personal matter.  And engineers, by their nature, are full of ideas for improvement. Since the release of …
Magnetisches und elektrisches Feld auf einer Leiterplatte
三步识别电磁干扰 (EMI) Monday, July 26, 2021
辐射杂散(通常称为电磁干扰 (EMI))受到严格监管,以确保电气和电子设备能够可靠运行,且对用户安全。法规对允许的辐射杂散水平进行了限制。为确保其产品不会超出这些限制,设计人员需要投入大量的时间和精力。EMI 带来挑战的原因之一是,杂散往往与整个系统设计相关。 定义电磁干扰 (EMI) EMI(也称为射频干扰或 RFI)主要关注的是产品对现有无线电、电视和其他通信系统(例如移动电话)产生的干扰。在美国以外的地区,它还包括产品对于静电放电和电源线瞬变等外部能源的抗干扰能力。这通常适用于商业、消费、工业、医疗和科学产品。辐射杂散通常在距离产品 3 米或 10 米的范围内进行测量。 电磁干扰的原因 EMI 的产生通常源于三个主要因素:产生谐波信号的能量源、类似天线的结构,如辐射谐波的 IO 或电源电缆,以及连接这两者的耦合路径。尽管听起来似乎只需消除其中一个因素,能量源、耦合路径或天线 …
6 Series Oscilloscope with a Near Field Probe
Troubleshooting EMI – 2 Tips and a Case Study Tuesday, April 7, 2020
Your design is exceeding the radiated emissions allowed by EMC regulations, now what? Whether you’re performing pre-compliance testing or troubleshooting a failed formal compliance test, our latest generation oscilloscopes make what was once an overwhelming task far simpler and more straightforward. Below are two helpful tips and a case study to help you troubleshoot EMI. For an even deeper dive …
Tektronix to Demonstrate Wide Bandgap Power Solutions at APEC 2019
Tektronix to Demonstrate Wide Bandgap Power Solutions at APEC 2019 Saturday, March 16, 2019
The big news for Tektronix at the APEC 2019 Conference next week will be a new solutions kit for SiC MOSFET and GaN FET switching power conversion testing. Tektronix offers the only solution on the market that can accurately characterize all the critical parameters for optimizing power electronics topologies that use wide bandgap Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductors …